Plasma Cleaner/Asher

Plasma cleaner/Asher

There are many differences between the nature of plasma, at 40 kHz and 13.56 and microwave. However, it may be possible to use all of these frequencies in some applications.
In general, at low frequencies, both electrons and ions are displaced in the plasma medium. Ions have a negative or positive electric charge, and the mass of ions is much higher than that of an electron. But at low frequencies there is ample opportunity to move both ions and electrons. But the higher the frequency, the less opportunity the ions have to move. As a result, the plasma density increases at high frequencies.
Plasma densities are generally higher at RF frequencies than at LF. Also, due to the acceleration of ions, which have a high mass, the phenomenon of sputtring of the sample and the surface of the product or the contamination caused by the chamber walls are higher in the LF frequency. And transfers more heat load to the sample, Because at LF the accelerated particles collide with it more .

*In general, low frequency plasma can be used for physical operations, microwave frequencies for chemical operations, and rf frequencies for both.*

For example, high frequency is the best option for performing chemical interactions at the surface of a product or sample. Because the electrons that produce ions and radicals, do the job of producing plasma, and as the Ions motility is small, they do not have a destructive effect and under these conditions, there are large numbers of ions and radicals on the surface of the product or sample that are ready to undergo chemical reactions.
Also, with increasing frequency, other parameters such as internal bias also decrease.
As the frequency increases (towards the microwave), the plasma changes from a volumetric uniform plasma to a surface plasma (due to the penetration depth limitations).
And other differences…


Row System Parameters Model M2V03VT- (System options)
m2v03VT m2v03VT m2v03VT m2v03VT m2v03VT m2v03VT m2v03VT m2v03VT
-A -B -C -D -E -F -G -H
1 Chamber body 125mm Dia x 240mm Pyrex chamber
Quartz chamber
2 Plasma Generator 40KHZ
400 KHZ plasma
RF 13.56MHz
3 Gas flow control 2 needle valves
Ar+O2                      (2 MFC) 200SCCM
Gas flow monitor Rotameter
4 Control – Keys –
Monitoring Volume
and digital display
Graphical touch screen
6 Vacuum Gauge Pirani corrosion resistive
7 Sample holder Steel
8 Vacuum Pump 6 m3/hr 2 stage Rotary not included
Oil mist filter not included

Basic spec

M2V03 Specs:

Parameter Value – options
  •  Size: diameter:125 mm, length: 240 mm.
  • Main body Material: Pyrex.
  • Sample holder: Aluminum
Plasma generator
  •  RF Gen and Auto matching :13.56MHz
  •  Power: 0 to 2000w
Input gas
  •  two input gas.
  •  MFC or needle valve gas control .
Control and Monitor
  •  Graphical and touch control panel
  • Parameters: vacuum pressure, time,rotameter gas flow, plasma power, system components automatic and manual safe enable/disable.
  • Automatic process management.
Plasma Generation
  • External capacitive electrodes.
Vacuum pump
  •  2-stage Oil-sealed Rotary Vane Pump
Vacuum gauge Corrosion resistant Pirani gauge
  •  Dimensions: 420*500*220 mm (W,L,H)
  •  Material: Aluminum.
Main input power
  •  220v AC. 50 Hz – 60Hz